McDermid Low Melting Point Solder HRL1-OM550 SDGs
Introducing examples of achieving energy savings and cost reduction with low melting point solder! Contributing to carbon neutrality through CO2 reduction! Impact resistance equivalent to SAC305!
HRL1 OM-550 is a low-melting solder paste designed to improve yield and reduce component warpage. It significantly enhances drop impact resistance and thermal cycling resistance compared to the company's conventional products. Its melting point is considerably lower than that of SAC305, achieving energy savings in the assembly process by lowering the peak temperature during reflow from 245°C to 185°C. <Significant Improvement in Reliability> ● The reliability of HRL1 OM-550 has been significantly improved compared to the company's conventional low-melting solder, exhibiting performance close to that of SAC305. ● The drop impact test performance at the BGA ball joints using SAC series is significantly improved compared to the company's conventional low-melting solder. ● The thermal cycling test performance at the BGA ball joints using SAC series is significantly improved compared to the company's conventional low-melting solder. ● The HRL1 alloy is more suitable as a replacement for SAC series alloys compared to the company's conventional low-melting solder.
- Company：セイワ 東京本社、関西支社、名古屋営業所、中国無錫 グループ会社 エレクトロン（長野県松本市）
- Price：Other
